贴片红胶 

．特征（Features ） 1. Much lower temperature curing is aimed at amd is practically possible. 2. Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots. 3. stable adhesive strength can be obtained with a variety of SMD. 4. Long-term preservation stability is expected. 5. High heat-resistivity and excellent electric properties are possessed. 1． 容许低温度硬化。 2． 尽管超高速涂敷、微少量涂敷仍可保持没有拉丝，塌陷的稳定形状。 3． 对於各种表面粘着零件，可获得安定的接着强度。 4． 储存安定性优良。 5． 具有高度耐热性和优良的电气特性。 6．固化条件（Curing condition） ○Recommended curing condition:Over 150 sec after PCB’s surface temperature has reached 110℃.or over 120 sec after PCB’s surface temperature has reached 120℃. ○When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs. 固化条件 ○建议固化条件是PCB板表面温度达到110℃后150秒以上，或者是达到120℃后120秒以上。 ○固化温度越高，且固化时间越长，可获得更高的粘接强度，依PCB板上装着元件材质、大小不同而实际附加于接着剂的温度会有所不同，因此请依据实际生产情况找出最适合的固化条件。[本信息来自于今日推荐网]